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LTC2974CUP-PBF Datasheet, PDF (95/98 Pages) Linear Technology – 4-Channel PMBus Power System Manager
APPLICATIONS INFORMATION
100k
100k
VSENSEP
LTC2974
VSENSEM
2974 F41
Figure 41. Connecting Unused Inputs to GND
prevent loading of the filter. The temperature sense inputs
(TSENSEn) may be left floating. The temperture reported on
floating TSENSEn inputs will be the internal die temperature
(READ_TEMPERATURE_2).
PCB Board Layout
Mechanical stress on a PC board and soldering-induced
stress can cause the LTC2974’s reference voltage and the
voltage drift to shift. A simple way to reduce the stress-
related shifts is to mount the IC near the short edge of
the PC board, or in a corner. The board acts as a stress
boundary, or a region where the flexure of the board is
minimal.
LTC2974
QFN PACKAGE
APERATURE DESIGN 50% TO 80% REDUCTION
GROUND PLANE
2974 F42
Figure 42. Suggested Screen Pattern for Die Attach Pad
For more information www.linear.com/LTC2974
2974fa
95