LT3483_15 Datasheet, PDF (9/12 Pages) Linear Technology – Inverting Micropower DC/DC Converters with Schottky

TYPICAL APPLICATIONS
3.6V to –8V DC/DC Converter
Low Profile, Small Footprint
V_IN
3.6V
C1
4.7µF
L1
10µH
C2
0.22µF
SW
V_IN
D
LT3483
SHDN FB
GND
D1
10Ω
5pF
R1
806k
V_OUT
–8V
25mA
C3
2.2µF
C1: MURATA GRM219R61A475KE34B
C2: TAIYO YUDEN LMK107BJ224
C3: MURATA GRM219R61C225KA88B
D1: PHILIPS PMEG2005EB
L1: MURATA LQH2MCN100K02L
3483 TA04a
V_OUT
20mV/DIV
I_SW
100mA/DIV
LT3483/LT3483A
Switching Waveform
2µs/DIV
3483 TA04b
PACKAGE DESCRIPTION
DC Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1719 Rev A)
2.55 ±0.05
1.15
±0.05
0.64 ±0.05
(2 SIDES)
0.70 ±0.05
PACKAGE ^{PIN 1 BAR}
OUTLINE ^{TOP MARK}
(SEE NOTE 6)
1.37 ±0.05
(2 SIDES)
0.25 ± 0.05
0.45 BSC
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
R = 0.05
TYP
R = 0.115
TYP
5
8
0.40 ± 0.10
2.00 ±0.10 0.64 ± 0.10
(4 SIDES) (2 SIDES)
0.75 ±0.05
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
(DC8) DFN 0409 REVA
4
1
0.23 ± 0.05
0.45 BSC
1.37 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
3483fc
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