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LT1026_15 Datasheet, PDF (7/8 Pages) Linear Technology – Voltage Converter
LT1026
PACKAGE DESCRIPTION
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
.300 BSC
(7.62 BSC)
CORNER LEADS OPTION
(4 PLCS)
.200
(5.080)
MAX
.005
(0.127)
MIN
.008 – .018
(0.203 – 0.457)
0° – 15° .045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
.045 – .065
(1.143 – 1.651)
.014 – .026
(0.360 – 0.660)
.015 – .060
(0.381 – 1.524)
.025
(0.635)
RAD TYP
.100
(2.54)
BSC
.125
3.175
MIN
OBSOLETE PACKAGE
.405
(10.287)
MAX
8
7
6
5
.220 – .310
(5.588 – 7.874)
1
2
3
4
J8 0801
.300 – .325
(7.620 – 8.255)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.400*
(10.160)
MAX
8
7
6
5
.008 – .015
(0.203 – 0.381)
+.035
.325 –.015
( ) 8.255
+0.889
–0.381
.065
(1.651)
TYP
.100
(2.54)
BSC
.255 ± .015*
(6.477 ± 0.381)
.120
(3.048) .020
MIN (0.508)
.018 ± .003
MIN
(0.457 ± 0.076)
NOTE:
1. DIMENSIONS
ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
12
34
N8 1002
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
.053 – .069
(1.346 – 1.752)
0°– 8° TYP
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.004 – .010
(0.101 – 0.254)
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
.050 BSC
.045 ±.005
.050
(1.270)
BSC
.228 – .244
(5.791 – 6.197)
.150 – .157 .245
(3.810 – 3.988) MIN
NOTE 3
.160 ±.005
1
2
34
.030 ±.005
TYP
SO8 0303
RECOMMENDED SOLDER PAD LAYOUT
1026fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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