LT1004 Datasheet, PDF (7/8 Pages) Texas Instruments – MICROPOWER INTEGRATED VOLTAGE REFERENCES

PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
LT1004
H Package
2-Lead and 3-Lead TO-46 Metal Can
(LTC DWG # 05-08-1340)
0.209 – 0.219
(5.309 – 5.537)
0.178 – 0.195
(4.521 – 4.953)
REFERENCE
PLANE
0.500
(12.700)
MIN
0.016 – 0.019**
(0.406 – 0.483)
DIA
0.050
(1.270)
TYP
0.100
(2.540)
TYP
PIN 1
45°
0.036 – 0.046
(0.914 – 1.168)
0.085 – 0.105
(2.159 – 2.667)
*
0.025
(0.635)
MAX
0.050
(1.270)
TYP
FOR 3-LEAD PACKAGE ONLY
0.028 – 0.048
(0.711 – 1.219)
H02/03(TO-46) 1197
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
Z Package
3-Lead Plastic TO-92 (Similar to TO-226)
(LTC DWG # 05-08-1410)
0.060 ± 0.010
(1.524 ± 0.254)
0.060 ± 0.005
(1.524± 0.127)
DIA
0.180 ± 0.005
(4.572 ± 0.127)
0.180 ± 0.005
(4.572 ± 0.127)
0.90
(2.286)
NOM
10° NOM
0.140 ± 0.010
(3.556 ± 0.127)
Z3 (TO-92) 0695
0.500
(12.70)
MIN
0.050 _UNCONTROLLED
(1.270) ^{LEAD DIMENSION}
MAX
5°
NOM
0.050 ± 0.005
(1.270 ± 0.127)
0.016 ± 0.003
(0.406 ± 0.076)
0.015 ± 0.002
(0.381 ± 0.051)
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
0.010
(0.254
–
–
0.020
0.508)
×
45°
0.008 – 0.010
(0.203 – 0.254)
0°– 8° TYP
0.053 – 0.069
(1.346 – 1.752)
0.016 – 0.050
0.406 – 1.270
0.014 – 0.019
(0.355 – 0.483)
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
TYP
0.228 – 0.244
(5.791 – 6.197)
0.189 – 0.197*
(4.801 – 5.004)
8
7
6
5
1
2
34
0.150 – 0.157**
(3.810 – 3.988)
SO8 0996
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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