LT1034-1.2 Datasheet, PDF (6/8 Pages) Linear Technology – Micropower Dual Reference

LT1034-1.2/LT1034-2.5
PACKAGE DESCRIPTIO
0.209 – 0.219
(5.309 – 5.537)
0.178 – 0.195
(4.521 – 4.953)
REFERENCE
PLANE
0.500
(12.700)
MIN
0.016 – 0.021**
(0.406 – 0.533)
DIA
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
0.085 – 0.105
(2.159 – 2.667)
0.050
(1.270)
TYP
0.100
(2.540)
TYP
PIN 1
*
0.025
(0.635)
MAX
45°
0.036 – 0.046
(0.914 – 1.168)
0.050
(1.270)
TYP
FOR 3-LEAD PACKAGE ONLY
0.028 – 0.048
(0.711 – 1.219)
H02/03(TO-46) 1098
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
OBSOLETE PACKAGE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
0.189 – 0.197*
(4.801 – 5.004)
8
7
6
5
6
0.228 – 0.244
(5.791 – 6.197)
0.150 – 0.157**
(3.810 – 3.988)
1
2
0.010
(0.254
–
–
0.020
0.508)
×
45°
0.008 – 0.010
(0.203 – 0.254)
0.053 – 0.069
(1.346 – 1.752)
0°– 8° TYP
0.016 – 0.050
(0.406 – 1.270)
0.014 – 0.019
(0.355 – 0.483)
TYP
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
34
SO8 1298
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
BSC
1034fe