LT1009_15 Datasheet, PDF (6/8 Pages) Linear Technology – 2.5V Reference

LT1009 Series
PACKAGE DESCRIPTION
H Package
2-Lead and 3-Lead TO-46 Metal Can
(Reference LTC DWG # 05-08-1340)
.209 – .219
(5.309 – 5.537)
.178 – .195
(4.521 – 4.953)
.500
(12.700)
MIN
REFERENCE
PLANE
.016 – .019**
(0.406 – 0.483)
DIA
.085 – .105
(2.159 – 2.667)
.050
(1.270)
TYP
.100
(2.540)
TYP
PIN 1
.025
(0.635)
MAX
SEATING*
PLANE
45o
.036 – .046
(0.914 – 1.168)
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND .050" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
.016
(0.406
–
–
.024
0.610)
OBSOLETE PACKAGE
.050
(1.270)
TYP
FOR 3-LEAD PACKAGE ONLY
.028 – .048
(0.711 – 1.219)
H02/03(TO-46) 0801
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
3.00 p 0.102
(.118 p .004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
0.889 p 0.127
(.035 p .005)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
DETAIL “A”
0o – 6o TYP
4.90 p 0.152
(.193 p .006)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
GAUGE PLANE
0.18
(.007)
0.53 p 0.152
(.021 p .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
PLANE _{0.22 – 0.38}
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP
0.65
(.0256)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.034)
REF
0.1016 p 0.0508
(.004 p .002)
MSOP (MS8) 0307 REV F
1009ff
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