LTC3129-1_15 Datasheet, PDF (4/30 Pages) Linear Technology – 15V, 200mA Synchronous Buck-Boost DC/DC Converter with 1.3A Quiescent Current

LTC3129-1
Electrical Characteristics The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at T_A = 25°C (Note 2). Unless otherwise noted, V_IN = 12V, V_OUT = 5V.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V_CC UVLO Threshold (Rising)
V_CC UVLO Hysteresis
V_CC Current Limit
V_CC Back-Drive Voltage (Maximum)
V_CC Input Current (Back-Driven)
V_CC Leakage to V_IN if V_CC>V_IN
V_OUT UV Threshold (Rising)
V_OUT UV Hysteresis
V_OUT Current – Shutdown
V_OUT Current – Sleep
V_OUT Current – Active
PGOOD Threshold, Falling
PGOOD Hysteresis
PGOOD Voltage Low
PGOOD Leakage
l 2.1
2.25
2.42
V
60
mV
V_CC = 0V
l
4
20
40
mA
l
5.5
V
V_CC = 5.5V (Switching)
V_CC = 5.5V, V_IN = 1.8V, Measured on V_IN
2
4
mA
–27
µA
l 0.95
1.15
1.35
V
150
mV
RUN = 0V, V_OUT = 15V Including Switch Leakage
PWM = 0V, V_OUT ≥ V_REG
PWM = V_CC, V_OUT = 15V (Note 4)
Referenced to Programmed V_OUT Voltage
Referenced to Programmed V_OUT Voltage
I_SINK = 1mA
PGOOD = 15V
10
100
nA
V_OUT/27
µA
5
9
µA
–5.5
–7.5
–10
%
2.5
%
250
300
mV
1
50
nA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3129-1 is tested under pulsed load conditions such
that T_J ≈ T_A. The LTC3129E-1 is guaranteed to meet specifications
from 0°C to 85°C junction temperature. Specifications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3129I-1 is guaranteed over the full –40°C to 125°C operating junction
temperature range. The junction temperature (T_J, in °C) is calculated from
the ambient temperature (T_A, in °C) and power dissipation (P_D, in watts)
according to the formula:
T_J = T_A + (P_D • θ_JA),
where θ_JA (in °C/W) is the package thermal impedance.
Note that the maximum ambient temperature consistent with these
specifications is determined by specific operating conditions in
conjunction with board layout, the rated thermal package thermal
resistance and other environmental factors.
Note 3: Specification is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a much higher thermal resistance.
Note 7: Switch timing measurements are made in an open-loop test
configuration. Timing in the application may vary somewhat from these
values due to differences in the switch pin voltage during non-overlap
durations when switch pin voltage is influenced by the magnitude and
duration of the inductor current.
Note 8: Voltage transients on the switch pin(s) beyond the DC limits
specified in the Absolute Maximum Ratings are non-disruptive to normal
operation when using good layout practices as described elsewhere in the
data sheet and Application Notes and as seen on the product demo board.
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For more information www.linear.com/LTC3129-1