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LTC3109_15 Datasheet, PDF (4/24 Pages) Linear Technology – Auto-Polarity, Ultralow Voltage Step-Up Converter and Power Manager
LTC3109
Electrical Characteristics
board layout, the rated thermal package thermal resistance and other
environmental factors. The junction temperature (TJ) is calculated from
the ambient temperature (TA) and power dissipation (PD) according to
the formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal
impedance.
Note 3: Specification is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: Failure to solder the exposed backside of the QFN package to the
PC board ground plane will result in a thermal resistance much higher
than 37°C/W.
Note 6: The Absolute Maximum Rating is a DC rating. Under certain
conditions in the applications shown, the peak AC voltage on the C2A and
C2B pins may exceed ±8V. This behavior is normal and acceptable because
the current into the pin is limited by the impedance of the coupling
capacitor.
Typical Performance Characteristics TA = 25°C, unless otherwise noted.
IIN vs VIN
1000
VOUT = 0V
100
IVOUT vs VIN
10000
1:100 RATIO, C1 = 1nF
1:50 RATIO, C1 = 4.7nF
1:20 RATIO, C1 = 10nF
VOUT = 3.3V
1000 NO LOAD ON VLDO
10
1
10
1:100 RATIO, C1 = 1nF
1:50 RATIO, C1 = 4.7nF
1:20 RATIO, C1 = 10nF
100
VIN (mV)
1000
3109 G01
100
10
10
100
VIN (mV)
Input Resistance vs VIN
7.0
VOUT = 0V
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
10
1:100 RATIO, C1 = 1nF
1:50 RATIO, C1 = 4.7nF
1:20 RATIO, C1 = 10nF
100
VIN (mV)
1000
3109 G03
Efficiency vs VIN
50
1:100 RATIO, C1 = 1nF
45
1:50 RATIO, C1 = 4.7nF
40
1:20 RATIO, C1 = 10nF
VOUT = 0V
35
30
25
20
15
10
5
0
10
100
VIN (mV)
PVOUT vs VIN
100
1:50 RATIO
C1 = 4.7nF
10
1
VOUT = 5V
VOUT = 3.3V
1000
3109 G02
1000
3109 G04
0.1
10
100
VIN (mV)
1000
3109 G18
Open-Circuit Start-Up Voltage
vs Source Resistance
90
80
70
60
50
40
30
20
10
0
0 1 2 3 4 5 6 7 8 9 10
SOURCE RESISTANCE (Ω)
3109 G05
3109fb
4
For more information www.linear.com/LTC3109