LTC6957-1_15 Datasheet, PDF (35/36 Pages) Linear Technology – Low Phase Noise, Dual Output Buffer/Driver/ Logic Converter

LTC6957-1/LTC6957-2/
LTC6957-3/LTC6957-4
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS Package
12-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1668 Rev Ø)
0.889 ±0.127
(.035 ±.005)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ±0.038
(.0165 ±.0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
12 11 10 9 8 7
0.406 ±0.076
(.016 ±.003)
REF
0.254
(.010)
GAUGE PLANE
0.18
(.007)
DETAIL “A”
0° – 6° TYP
DETAIL “A”
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
4.90 ±0.152
(.193 ±.006)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
1.10
(.043)
MAX
1 23 456
0.86
(.034)
REF
0.22 – 0.38
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
(.009 – .015)
TYP
0.650
(.0256)
BSC
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.1016 ±0.0508
(.004 ±.002)
MSOP (MS12) 1107 REV Ø
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnFeoctriomn ofrietsincifrocurmitsaatsiodneswcrwibewd.lhinereeainr.cwoillmno/LtTinCfr6in9g5e7o-n1existing patent rights.
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