LTC3675 Datasheet, PDF (35/36 Pages) Linear Technology – 7-Channel Confi gurable High Power PMIC

PACKAGE DESCRIPTION
UFFMA Package
44-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1762 Rev A)
1.48 ±0.05
4.50 ±0.05
3.10 ±0.05
2.40 REF
2.56 ±0.05
2.64 ±0.05
1.70 ±0.05
2.02 ±0.05
2.76 ±0.05
0.70 ±0.05
0.98 ±0.05
LTC3675
4.00 p0.10
PIN 1
TOP MARK
(SEE NOTE 6)
PACKAGE
OUTLINE
0.20 ±0.05
0.40 BSC
5.60 REF
6.10 ±0.05
7.50 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.75 p0.05
0.00 – 0.05
2.40 REF
43 44
2.64
±0.10
2.56
±0.10
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
0.40 p0.10
1
2
7.00 p0.10
0.200 REF
5.60 REF
1.70
R = 0.10
±0.10 _2.76 ^TYP
±0.10
0.74 ±0.10
R = 0.10 TYP
0.74 ±0.10
R = 0.10 TYP
0.98 ±0.10
(UFF44MA) QFN REV A 0410
0.20 p0.05
0.40 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3675f
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