LTC2242-12_15 Datasheet, PDF (28/30 Pages) Linear Technology – 12-Bit, 250Msps ADC

LTC2242-12
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705 Rev C)
0.70 ±0.05
7.15 ±0.05
7.50 REF
(4 SIDES)
8.10 ±0.05 9.50 ±0.05
7.15 ±0.05
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
9 .00 ± 0.10
(4 SIDES)
PIN 1 TOP MARK
(SEE NOTE 5)
PACKAGE OUTLINE
0.75 ± 0.05
R = 0.10
TYP
7.50 REF
(4-SIDES)
R = 0.115
TYP
7.15 ± 0.10
63 64
PIN 1
CHAMFER
C = 0.35
0.40 ± 0.10
1
2
7.15 ± 0.10
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
28
(UP64) QFN 0406 REV C
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
224212fc