LTC2208-14 Datasheet, PDF (27/28 Pages) Linear Technology – 14-Bit, 130Msps ADC

PACKAGE DESCRIPTIO
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 ±0.05
LTC2208-14
7.15 ±0.05
(4 SIDES)
8.10 ±0.05
9.50 ±0.05
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
9 .00 ± 0.10
(4 SIDES)
PIN 1 TOP MARK
(SEE NOTE 5)
PACKAGE OUTLINE
0.75 ± 0.05
7.15 ± 0.10
(4-SIDES)
R = 0.115
TYP
63 64
PIN 1
CHAMFER
0.40 ± 0.10
1
2
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
(UP64) QFN 1003
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
220814f
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