LTC3854 Datasheet, PDF (26/28 Pages) Linear Technology – Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller

LTC3854
Package Description
MSE ^MPa^Sc^Ek^Pa^ag^ce^kage
12-Lea¹d^2-P^Lela^as^dti^Pc^laM^sS^tiO^c P^M,^SE^Ox^Pp^,o^Es^xe^pd^osD^ei^de^DPⁱa^ed^Pad
(Refere^(Rnc^ee^feL^reTⁿC^ceD^LW^TCG^D#^W0^G5-^#08⁰-⁵1^-6⁰6⁸6^-1R⁶⁶e⁶v ^RB^e)^{v B)}
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 p 0.102
2.845 p 0.102
(.112 p .004)
0.889 p 0.127
(.112 p .004)
(.035 p .005)
1
6
0.35
REF
5.23
(.206)
MIN
1.651 p 0.102 3.20 – 3.45
(.065 p .004) (.126 – .136)
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
12
7
4.039 p 0.102
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
(.159 p .004)
(NOTE 3)
0.406 p 0.076
12 11 10 9 8 7
(.016 p .003)
REF
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0o – 6o TYP
4.90 p 0.152
(.193 p .006)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.18
(.007)
0.53 p 0.152
(.021 p .006)
DETAIL “A”
1.10
(.043)
MAX
1 23 456
0.86
(.034)
REF
SEATING
PLANE _{0.22 – 0.38}
0.1016 p 0.0508
NOTE:
(.009 – .015)
TYP
0.650
(.0256)
(.004 p .002)
MSOP (MSE12) 0608 REV B
1. DIMENSIONS IN MILLIMETER/(INCH)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3854fa
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