LTC3714_15 Datasheet, PDF (25/28 Pages) Linear Technology – Intel Compatible, Wide Operating Range, Step-Down Controller with Internal Op Amp

LTC3714
Applications Information
These items are also illustrated in Figures 10 and 11.
• Segregate the signal and power grounds. All small
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to
the source of M2.
• Place M2 as close to the controller as possible, keeping
the PGND, BG and SENSE traces short.
• Connect the input capacitor(s) C_IN close to the power
MOSFETs. This capacitor carries the MOSFET AC
current.
• Keep the high dV/dT SW, BOOST and TG nodes away
from sensitive small-signal nodes.
• Connect the INTV_CC decoupling capacitor C_VCC closely
to the INTV_CC and PGND pins.
• Connect the top driver boost capacitor C_B closely to
the BOOST and SW pins.
• Connect the V_IN pin decoupling capacitor C_F closely to
the V_IN and PGND pins.
• VID0-VID4 interface circuitry must return to SGND.
V_IN
C_IN
C_IN
C_IN
C_IN
SW
PGND
R_SENSE
TO PGND
(PIN 2)
M1
M2
D1
SENSE
TO SENSE
(PIN 3)
M1
M2
M2
L1
PGND
C_OUT C_OUT C_OUT C_{OUT VOUT}
3714 F11
Figure 11. General Layout of External Power Components
3714f
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