LTC3633_15 Datasheet, PDF (25/28 Pages) Linear Technology – Dual Channel 3A, 15V Monolithic Synchronous Step-Down Regulator

TYPICAL APPLICATIONS
1.2V/1.8V Buck Regulator with Coincident Tracking and 6V Input UVLO
V_IN
3.6V TO 15V
C1
47µF
R7
154k
×2
R8
40k
R5
162k
V_OUT2
1.2V AT 3A
C_OUT2
68µF
L2
0.47µH 0.1µF
R4
R3
10k _10k
RUN1
RUN2
RT
V_IN2 V_{IN1 INTVCC}
ITH1
ITH2
MODE/SYNC
V2P5
LTC3633 _PHMODE
TRACKSS2
BOOST2
BOOST1
SW2
V_ON2
V_FB2
SGND PGND
SW1
V_ON1
V_FB1
C2
2.2µF
L1
0.1µF 0.68µH
R1
R6
R2
10k ^4.99k
15k
LTC3633
V_OUT1
1.8V AT 3A
C_OUT1
47µF
3633 TA03
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev J)
Exposed Pad Variation EB
4.75
(.187)
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
28 27 26 2524 23 22 21 20 1918 17 16 15
6.60 ±0.10
2.74
(.108)
4.50 ±0.10
SEE NOTE 4
0.45 ±0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN _MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
For more information www.linear.com/LTC3633
0.05 – 0.15
(.002 – .006)
FE28 (EB) TSSOP REV J 1012
3633fd
25