LTC2383-16_15 Datasheet, PDF (23/24 Pages) Linear Technology – 16-Bit, 1Msps, Low Power SAR ADC with Serial Interface

LTC2383-16
PACKAGE DESCRIPTION
DE Package
16-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1732 Rev Ø)
0.70 ±0.05
4.00 ±0.10
(2 SIDES)
9
R = 0.05
TYP
R = 0.115
TYP
0.40 ± 0.10
16
3.60 ±0.05
2.20 ±0.05
3.30 ±0.05
1.70 ± 0.05
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
3.00 ±0.10
(2 SIDES)
3.30 ±0.10
1.70 ± 0.10
8
PIN 1 NOTCH
R = 0.20 OR
0.35 s 45°
CHAMFER
(DE16) DFN 0806 REV Ø
1
0.25 ± 0.05
0.45 BSC
0.200 REF
0.75 ±0.05
0.23 ± 0.05
0.45 BSC
3.15 REF
3.15 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05 ^{BOTTOM VIEW—EXPOSED PAD}
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev Ø)
0.889 p 0.127
(.035 p .005)
4.039 p 0.102
(.159 p .004)
(NOTE 3)
16151413121110 9
0.280 p 0.076
(.011 p .003)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0o – 6o TYP
4.90 p 0.152
(.193 p .006)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.305 p 0.038
(.0120 p .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.007)
0.53 p 0.152
(.021 p .006)
DETAIL “A”
1.10
(.043)
MAX
12345678
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
SEATING
PLANE
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
0.86
(.034)
REF
0.1016 p 0.0508
(.004 p .002)
MSOP (MS16) 1107 REV Ø
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation
that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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