LT6202_15 Datasheet, PDF (22/28 Pages) Linear Technology – Single/Dual/Quad 100MHz, Rail-to-Rail Input and Output

LT6202/LT6203/LT6204
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
0.70 ±0.05
R = 0.125
TYP
5
0.40 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.10 ±0.05 (2 SIDES)
PIN 1
TOP MARK
PACKAGE _{(NOTE 6)}
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
(DD8) DFN 0509 REV C
1
0.50 BSC
2.38 ±0.10
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.045 ±.005
.189 – .196*
(4.801 – 4.978)
16 15 14 13 12 11 10 9
.009
(0.229)
REF
.254 MIN
.150 – .165
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
22
.0165 ±.0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.007 – .0098
(0.178 – 0.249)
.015 ±.004
(0.38 ±0.10)
× 45°
0° – 8° TYP
1 234 5678
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
620234fd