RH1814_15 Datasheet, PDF (2/2 Pages) Linear Technology – Dual 3mA, 100MHz, 750V/s Operational Amplifi er

DICE SPECIFICATION
RH1814
DICE ELECTRICAL TEST LIMITS V_S = ±5V, V_CM = 0V, T_A = 25°C unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
PSRR
Power Supply Rejection Ratio
V_S = ±2V to ±5.5V
78
Channel Separation
V_O = ±3V, R_L = 100Ω
82
V_OUT
Output Voltage Swing
R_L = 500Ω, 30mV Overdrive
±3.8
R_L = 100Ω, 30mV Overdrive
±3.35
I_OUT
Maximum Output Current
V_OUT = ±3V, 30mV Overdrive
±40
I_SC
Output Short-Circuit Current
V_OUT = 0V, 1V Overdrive
±75
I_S
Supply Current
Per Amplifier
MAX UNITS
dB
dB
V
V
mA
mA
3.6
mA
DICE ELECTRICAL TEST LIMITS (Pre-Irradiation)
V_S = 5V, V_CM = 0V, T_A = 25°C unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
MAX UNITS
V_OS
Input Offset Voltage
I_OS
Input Offset Current
I_B
Input Bias Current
R_IN
Input Resistance
A_VOL
Large-Signal Voltage Gain
Input Voltage Range (Positive)
(Note 3)
V_CM = 1.5V to 3.5V
V_O = 1.5V to 3.5V, R_L ≥ 500Ω
V_O = 1.5V to 3.5V, R_L ≥ 100Ω
Guaranteed by CMRR
2
mV
400
nA
±4
μA
3
MΩ
1
V/mV
0.7
V/mV
3.5
V
Input Voltage Range (Negative)
Guaranteed by CMRR
1.5
V
CMRR
Common-Mode Rejection Ratio
V_CM = 1.5V to 3.5V
73
PSRR
Power Supply Rejection Ratio
V_S = ±2V to ±5.5V
78
Channel Separation
V_OUT = 1.5V to 3.5V, R_L = 100Ω
81
V_OUT
Output Voltage Swing (Positive)
R_L = 500Ω, 30mV Overdrive
3.9
R_L = 100Ω, 30mV Overdrive
3.7
V_OUT
Output Voltage Swing (Negative)
R_L = 500Ω, 30mV Overdrive
R_L = 100Ω, 30mV Overdrive
I_OUT
Maximum Output Current
V_OUT = 1.5V to 3.5V, 30mV Overdrive
±25
I_SC
Output Short-Circuit Current
V_OUT = 2.5V, 1V Overdrive
±55
I_S
Supply Current
Per Amplifier
dB
dB
mA
V
V
1.1
V
1.3
V
mA
mA
4
mA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Differential inputs of ±6V are appropriate for transient operation
only, such as during slewing. Large sustained differential inputs can cause
excessive power dissipation and may damage the part.
Note 3: Input offset voltage is pulse tested and is exclusive of warm-up
drift.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus
packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information
on dice performance and lot qualifications via lot sampling test procedures.
Dice data sheet subject to change. Please consult factory for current revision in production.
2
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
[phone] ^● FAX: [phone] ^● www.linear.com
I.D.No. 66-13-1814
LT 0807 • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 2007