RH1498 Datasheet, PDF (2/2 Pages) Linear Technology – 10MHz, 6V/μs Rail-to-Rail Input and Output Precision C-Load Op Amp

DICE/DWF SPECIFICATION
RH1498
DICE/DWF ELECTRICAL TEST LIMITS (Pre-Irradiation) V_S = ±15V; V_CM = V_OUT = 0V, T_A = 25°C, unless
otherwise noted.
SYMBOL PARAMETER
CONDITIONS
MIN
MAX UNITS
V_OH
Output Voltage Swing (High)
(Note 2)
I_SC
Short-Circuit Current
I_S
Supply Current per Amplifier
GBW
Gain-Bandwidth Product
No Load
I_SINK = 1mA
I_SINK = 10mA
f = 100kHz
10
mV
150
mV
800
mV
±15
mA
2.5
mA
6.8
MHz
SR
Slew Rate
A_V = –1, R_L = 2k
3.5
V/µs
V_O = ±10V, Measure at V_O = ±5V
DICE/DWF ELECTRICAL TEST LIMITS (Pre-Irradiation) V_S = 3V, 5V; V_CM = V_OUT = Half Supply, T_A = 25°C,
unless otherwise noted.
SYMBOL PARAMETER
CONDITIONS
MIN
V_OS
Input Offset Voltage
V_CM = V⁺, V^–
Input Offset Voltage Match (Channel-to-Channel) V_CM = V⁺ to V^–
(Note 1)
I_B
Input Bias Current
V_CM = V⁺
0
V_CM = V^–
–650
Input Bias Current Match (Channel-to-Channel) V_CM = V⁺, V^–
0
(Note 1)
I_OS
Input Offset Current
V_CM = V⁺, V^–
A_VOL
Large-Signal Voltage Gain
V_S = 5V, V_O = 75mV to 4.8V, R1 = 10k
600
V_S = 3V, V_O = 75mV to 2.8V, R1 = 10k
500
CMRR
Common Mode Rejection Ratio
V_S = 5V, V_CM = V⁺ to V^–
76
V_S = 3V, V_CM = V⁺ to V^–
72
CMRR Match (Channel-to-Channel) (Note 1)
V_S = 5V, V_CM = V⁺ to V^–
75
V_S = 3V, V_CM = V⁺ to V^–
70
PSRR
Power Supply Rejection Ratio
V_S = 2.2V to 12V
88
PSRR Match (Channel-to-Channel) (Note 1)
V_S = ±2V to ±16V
82
V_OL
Output Voltage Swing (Low)
(Note 2)
No Load
I_SINK = 1mA
I_SINK = 2.5mA
V_OH
Output Voltage Swing (High)
(Note 2)
No Load
I_SINK = 1mA
I_SINK = 2.5mA
I_SC
Short-Circuit Current
±15
I_S
Supply Current per Amplifier
MAX UNITS
800
µV
1400
µV
650
nA
0
nA
100
nA
65
nA
V/mV
V/mV
dB
dB
dB
dB
dB
dB
30
mV
100
mV
200
mV
10
mV
150
mV
250
mV
mA
2.2
mA
Note 1: Matching parameters are the difference between amplifiers A
and B.
Note 2: Output voltage swings are measured between the output and
power supply rails.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus
packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information
on dice performance and lot qualifications via lot sampling test procedures.
Dice data sheet subject to change. Please consult factory for current revision in production.
I.D.No. 66-13-3415
2
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