RH119_15 Datasheet, PDF (2/2 Pages) Linear Technology – Dual Comparator

DICE SPECIFICATION
RH119
Rad Hard die require special handling as compared to standard IC
chips.
Rad Hard die are susceptible to surface damage because there is no
silicon nitride passivation as on standard die. Silicon nitride protects
the die surface from scratches by its hard and dense properties. The
passivation on Rad Hard die is silicon dioxide that is much “softer”
than silicon nitride.
LTC recommends that die handling be performed with extreme care so
as to protect the die surface from scratches. If the need arises to move
the die around from the chip tray, use a Teflon-tipped vacuum wand.
This wand can be made by pushing a small diameter Teflon tubing
onto the tip of a steel-tipped wand. The inside diameter of the Teflon
tip should match the die size for efficient pickup. The tip of the Teflon
should be cut square and flat to ensure good vacuum to die surface.
Ensure the Teflon tip remains clean from debris by inspecting under
stereoscope.
During die attach, care must be exercised to ensure no tweezers touch
the top of the die.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus
packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on
dice performance and lot qualifications via lot sampling test procedures.
Dice data sheet subject to change. Please consult factory for current revision in production.
I.D. No. 66-01-0176
2
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
[phone] ^●FAX:[phone] ^● www.linear-tech.com
LT/LT 0599 50 Rev A PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 1998