RH1086K Datasheet, PDF (2/2 Pages) Linear Technology – 1.5A/0.5A Low Dropout Positive Regulators

DICE SPECIFICATION
RH1086K/RH1086H
W
DICE ELECTRICAL TEST LI ITS
Note 1: See thermal regulation specifications for changes in output
voltage due to heating effects. Load and line regulation are measured
at a constant junction temperature by low duty cycle pulse testing.
Load regulation is measured at the output lead ≈ 1/8" from the
package.
Note 2: Line and load regulation are guaranteed up to the maximum
power dissipation of 15W for the RH1086K, 3W for the RH1086H.
Power dissipation is determined by the input/output differential and the
output current. Guaranteed maximum power dissipation will not be
available over the full input/output voltage range. See Short Circuit
Current Curve in the LT1086 Series standard data sheet for available
output current.
Note 3: Dropout voltage is specified over the full output current range
of the device. Test points and limits are shown on the Dropout Voltage
Curve in the LT1086 Series standard data sheet.
Note 4: Minimum load current is defined as the minimum output
current required to maintain regulation. At 25V input/output differential
the device is guaranteed to regulate if the output current is greater than
10mA.
Note 5: Guaranteed by design but not tested at wafer sort.
Note 6: For compliance with 883 revision C current density spec.
RH1086K is derated to 1.0A max load operation.
Rad Hard die require special handling as compared to standard IC chips.
Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die
surface from scratches by its hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much “softer” than silicon
nitride.
LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the
die around from the chip tray, use a Teflon-tipped vacuum wand. This wand can be made by pushing a small diameter Teflon tubing onto the tip of
a steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square
and flat to ensure good vacuum to die surface. Ensure the Teflon tip remains clean from debris by inspecting under stereoscope.
During die attach, care must be exercised to ensure no tweezers touch the top of the die.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus
packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on
dice performance and lot qualifications via lot sampling test procedures.
Dice data sheet subject to change. Please consult factory for current revision in production.
I.D. No. 66-11-1086
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Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
[phone] ^● FAX:[phone] ^● www.linear-tech.com
LT 0599 50 Rev A • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 1998