LTM8001_15 Datasheet, PDF (2/28 Pages) Linear Technology – 36VIN, 5A Module Regulator with 5-Output Configurable LDO Array

LTM8001
Absolute Maximum Ratings
(Note 1)
V_IN0............................................................................40V
V_IN45, BIAS45............................................................25V
BIAS123.....................................................................25V
FB0, RT, COMP, ILIM, V_REF..........................................3V
V_OUT0-5......................................................................25V
RUN, SYNC, SS............................................................6V
SET1-5 (Relative to V_OUT1-5, Respectively).............±0.3V
Current Into SET1-5.............................................. ±10mA
Current Into RUN Pin.............................................100µA
Maximum Junction Temperature (Notes 2, 3)........ 125°C
Peak Solder Reflow Body Temperature.................. 245°C
Storage Temperature.............................. –55°C to 125°C
Pin Configuration
TOP VIEW
V_OUT4 SET4 V_OUT3 SET3 SET2 V_OUT2
11
V_OUT5
10
SET5
9
BIAS45
8
BIAS123
V_IN45 ⁷
BANK 3 ₆
5
V_OUT0
BANK 4
4
GND
BANK 2
V_REF
SYNC
SS
3
2
1
V_OUT1
SET1
ILIM
RT
COMP
FBO
RUN
V_IN0
BANK 1
ABCDE FGHJ KL
BGA PACKAGE
121 PADS (15mm × 15mm × 3.42mm)
T_JMAX = 125°C, θ_JA = 16.1°C/W, θ_JCbottom = 5.99°C/W, θ_JCtop = 13.4°C/W, θ_JB = 4.98°C/W
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
WEIGHT = 1.8 GRAMS
Order Information
PART NUMBER
LTM8001EY#PBF
LTM8001IY#PBF
LTM8001IY
LTM8001MPY#PBF
LTM8001MPY
PAD OR BALL FINISH
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
PART MARKING*
DEVICE
FINISH CODE
LTM8001Y
e1
LTM8001Y
e1
LTM8001Y
e0
LTM8001Y
e1
LTM8001Y
e0
PACKAGE
TYPE
BGA
BGA
BGA
BGA
BGA
MSL
RATING
3
3
3
3
3
TEMPERATURE RANGE
(SEE NOTE 2)
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking:
www.linear.com/leadfree
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
8001fc
2
For more information www.linear.com/LTM8001