LTC6362 Datasheet, PDF (19/22 Pages) Linear Technology – Precision, Low Power Rail-to-Rail Input/Output

PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
0.889 ±0.127
(.035 ±.005)
LTC6362
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ± 0.038
(.0165 ±.0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ±0.152
(.193 ±.006)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
GAUGE PLANE
0.18
(.007)
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1.10
(.043)
MAX
1 234
SEATING
PLANE _{0.22 – 0.38}
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP
0.65
(.0256)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.034)
REF
0.1016 ±0.0508
(.004 ±.002)
MSOP (MS8) 0307 REV F
6362fa
19