LTC3444_15 Datasheet, PDF (19/20 Pages) Linear Technology – Micropower Synchronous Buck-Boost DC/DC Converter for WCDMA Applications

TYPICAL APPLICATIO S
LTC3444
Single Li-Ion, 3.1V to 4.2V Input, 3.3V at 400mA
Output with Internal Compensation
2.2μH
L1
3.1V TO 4.4V
C_IN
+ ^4.7μF
Li-Ion
LTC3444
SW1
SW2
V_IN
SHDN
V_OUT
FB
GND
V_C
R1
340k
R2
200k
V_OUT
3.3V AT 400mA
C_OUT
4.7μF
C_IN = MURATA:GRM31CR61C475K
C_OUT = MURATA:GRM31CR61C475K
L1 = COOPER BUSSMAN SD12-2R2
3444 TA04
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
R = 0.115
TYP
5
0.38 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
(DD) DFN 1203
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3444fb
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