LTC3772_15 Datasheet, PDF (18/20 Pages) Linear Technology – Micropower No RSENSE Constant Frequency Step-Down DC/DC Controller

LTC3772
PACKAGE DESCRIPTIO
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702)
0.61 ±0.05
(2 SIDES)
2.50 ±0.05
1.15 ±0.05
0.675 ±0.05
0.25 ± 0.05
0.50 BSC
2.20 ±0.05
(2 SIDES)
PACKAGE
OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ±0.10
(2 SIDES)
R = 0.115
TYP
0.56 ± 0.05
5
(2 SIDES)
0.38 ± 0.10
8
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0 – 0.05
4
0.25 ± 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
1
(DDB8) DFN 1103
0.50 BSC
2.15 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3772f
18