LTC2463_15 Datasheet, PDF (18/20 Pages) Linear Technology – Ultra-Tiny, 16-Bit I2C ADCs with 10ppm/C Max Precision Reference

LTC2461/LTC2463
PACKAGE DESCRIPTION
MS Package
12-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1668 Rev Ø)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
4.039 ± 0.102
(.159 ± .004)
(NOTE 3)
12 11 10 9 8 7
0.406 ± 0.076
(.016 ± .003)
REF
0.254
(.010)
GAUGE PLANE
0.18
(.007)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
SEATING
PLANE
1.10
(.043)
MAX
1 23 456
0.86
(.034)
REF
0.22 – 0.38
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
(.009 – .015)
TYP
0.650
(.0256)
BSC
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS12) 1107 REV Ø
24613fa
18