LT3024_1 Datasheet, PDF (18/20 Pages) Linear Technology – Dual 100mA/500mA Low Dropout, Low Noise,Micropower Regulator

LT3024
PACKAGE DESCRIPTION
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
3.60 ±0.05
2.20 ±0.05
3.30 ±0.05
1.70 ± 0.05
0.70 ±0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ±0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
R = 0.05
TYP
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
R = 0.115
7
TYP
0.40 ± 0.10
12
3.30 ±0.10
1.70 ± 0.10
6
0.25 ± 0.05
2.50 REF
1
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0806 REV D
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3024fa
18