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| LTC3610_15 Datasheet, PDF (17/24 Pages) Linear Technology – 24V, 12A Monolithic Synchronous Step-Down DC/DC Converter | |||
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LTC3610
Applications Information
INTVCC
VIN
CVCC
4.7µF
6.3V
SW
CF
RF1
0.1µF 1Ω
25V
GND
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
VOUT
2.5V AT
12A
C5
22µF
6.3V
(OPTIONAL)
GND
COUT1 +
220µF
2Ã
L1
0.8µH
VIN
5V TO 24V
VIN
GND
CIN
C6 +
10µF
10µF
35V
35V
3Ã
(OPTIONAL)
1 PGND
2 PGND
3 PGND
4 SW
5 SW
6 SW
7 SW
8 SW
9 SW
10 SW
11 SW
12 PVIN
13 PVIN
14 PVIN
15 PVIN
16 PVIN
LTC3610
SGND 48
SGND 47
SGND 46
SGND 45
EXTVCC 44
VFB 43
SGND 42
ION 41
SGND 40
FCB 39
ITH 38
VRNG 37
PGOOD 36
VON 35
SGND 34
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
CIN: TAIYO YUDEN GMK325BJ106MM-B
COUT: SANYO 10TPE220ML
L1: CDEP85NP-R80MC-50
C5: MURATA GRM31CR60J226KE19
SW
INTVCC
DB
CMDSH-3
CB1
0.22µF
SW
CSS
0.1µF
EXTVCC
C4
0.01µF
R1
9.5k
C1
1%
(OPTIONAL)
RON
182k
1%
CON
0.01µF
(OPTIONAL)
R5
31.84k
R2
30.1k
1%
(OPTIONAL)
C2
VOUT
VIN
CC1
470pF
R3
0Ω
RPG1
100k
INTVCC
C3
(OPTIONAL)
RSS1
510k
VIN
(OPTIONAL)
CC2
100pF
RVON
0Ω
VOUT
SGND
3610 F06
Figure 6. Design Example: 5V to 24V Input to 2.5V/12A at 550kHz
PC Board Layout Checklist
When laying out a PC board follow one of the two sug-
gested approaches. The simple PC board layout requires
a dedicated ground plane layer. Also, for higher currents, a
multilayer board is recommended to help with heat sinking
of power components.
⢠The ground plane layer should not have any traces and
it should be as close as possible to the layer with the
LTC3610.
⢠Place CIN and COUT all in one compact area, close to
the LTC3610. It may help to have some components
on the bottom side of the board.
⢠Keep small-signal components close to the LTC3610.
⢠Ground connections (including LTC3610 SGND and
PGND) should be made through immediate vias to
the ground plane. Use several larger vias for power
components.
⢠Use a compact plane for the switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
⢠Use planes for VIN and VOUT to maintain good voltage
filtering and to keep power losses low.
⢠Flood all unused areas on all layers with copper. Flood-
ing with copper reduces the temperature rise of power
components. Connect these copper areas to any DC
net (VIN, VOUT, GND or to any other DC rail in your
system).
3610ff
17
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