LT1011_15 Datasheet, PDF (17/20 Pages) Linear Technology – Voltage Comparator

LT1011/LT1011A
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
H Package
8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321)
0.040
(1.016)
MAX
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
OBSOLETE PACKAGE
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
45°TYP
0.028 – 0.034
(0.711 – 0.864)
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
0.016 – 0.021**
(0.406 – 0.533)
GAUGE
PLANE
REFERENCE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
0.027 – 0.045
(0.686 – 1.143)
PIN 1
0.230
(5.842)
TYP
H8 (TO-5) 0.230 PCD 1197
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
OBSOLETE PACKAGE
CORNER LEADS OPTION
(4 PLCS)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.300 BSC
(0.762 BSC)
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.005
(0.127)
MIN
0.025
(0.635)
RAD TYP
0.405
(10.287)
MAX
8
7
6
5
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.045 – 0.065
(1.143 – 1.651)
0.014 – 0.026
(0.360 – 0.660)
0.100
(2.54)
BSC
0.125
3.175
MIN
J8 1298
For more information www.linear.com/LT1011
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