LT1962_15 Datasheet, PDF (16/18 Pages) Linear Technology – 300mA, Low Noise, Micropower LDO Regulators

LT1962 Series
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS8 Package
8_M-L_Sea₈d_PP_al_ca_ks_ati_gc_eMSOP
(₈LT_-C_LeD_aW_dG_P#_la0_s5_t-_i0_c8-_M16_S6_O0_PRev G)
(Reference LTC DWG # 05-08-1660 Rev G)
0.889 ±0.127
(.035 ±.005)
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ± 0.038
(.0165 ±.0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ±0.152
(.193 ±.006)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
GAUGE PLANE
0.18
(.007)
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
PLANE _{0.22 – 0.38}
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP
0.65
(.0256)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.034)
REF
0.1016 ±0.0508
(.004 ±.002)
MSOP (MS8) 0213 REV G
16
For more information www.linear.com/LT1962
1962fba