LTC3873_15 Datasheet, PDF (15/16 Pages) Linear Technology – Frequency Current Mode Boost/Flyback/SEPIC DC/DC Controller

PACKAGE DESCRIPTION
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
LTC3873
0.61 p0.05
(2 SIDES)
2.55 p0.05
1.15 p0.05
0.70 p0.05
0.25 p 0.05
0.50 BSC
2.20 p0.05
(2 SIDES)
PACKAGE
OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 p0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
5
0.40 p 0.10
8
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 p0.10
(2 SIDES)
0.75 p0.05
0.56 p 0.05
(2 SIDES)
4
0.25 p 0.05
PIN 1
R = 0.20 OR
0.25 s 45o
CHAMFER
1
(DDB8) DFN 0905 REV B
0.50 BSC
0 – 0.05
2.15 p0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3873fa
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