LTC3443_15 Datasheet, PDF (15/16 Pages) Linear Technology – High Current Micropower 600kHz Synchronous Buck-Boost DC/DC Converter

PACKAGE DESCRIPTIO
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
LTC3443
3.60 ±0.05
2.20 ±0.05
3.30 ±0.05
1.70 ± 0.05
0.70 ±0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ±0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
R = 0.05
TYP
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
R = 0.115
7
TYP
0.40 ± 0.10
12
3.30 ±0.10
1.70 ± 0.10
6
0.25 ± 0.05
2.50 REF
1
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0806 REV D
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3443fa
15