LT3028 Datasheet, PDF (15/16 Pages) Linear Technology – Dual 100mA/500mA Low Dropout, Low Noise,Micropower Regulators with Independent Inputs

LT3028
APPLICATIONS INFORMATION
In circuits where a backup battery is required, several
different input/output conditions can occur. The output
voltage may be held up while the input is either pulled to
ground, pulled to some intermediate voltage or is left open
circuit.
When the IN pin of the LT3028 is forced below either OUT
pin or either OUT pin is pulled above the IN pin, input current
for the corresponding regulator will typically drop to less
than 2µA. This can happen if the input of the device is
connected to a discharged (low voltage) battery and the out-
put is held up by either a backup battery or a second regu-
lator circuit. The state of the SHDN1/SHDN2 pin will have
no effect on the reverse output current when the output is
pulled above the input.
PACKAGE DESCRIPTIO
3.58
(.141)
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
16 1514 13 12 1110 9
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.94
(.116)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
2.94 ^6.40
(.116) ^(.252)
BSC
12345678
1.10
(.0433)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE16 (BB) TSSOP 0204
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3028f
15