LT1072IT Datasheet, PDF (15/16 Pages) Linear Technology – Available in MiniDiP, TO-220, and TO-3 Packages

PACKAGE DESCRIPTIO
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.050 BSC
N
.245
MIN
1
2
3
.045 ±.005
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
N
.160 ±.005
.228 – .244
(5.791 – 6.197)
N/2
.150 – .157
(3.810 – 3.988)
NOTE 3
N/2
.030 ±.005
TYP _{RECOMMENDED SOLDER PAD LAYOUT}
1
2
34
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.050
(1.270)
BSC
SO8 0502
.030 ±.005
TYP
N
SW Package
16-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
.050 BSC .045 ±.005
.398 – .413
(10.109 – 10.490)
NOTE 4
16 15 14 13 12 11 10 9
N
.420
.325 ±.005
MIN
NOTE 3
.394 – .419
(10.007 – 10.643)
.005
(0.127)
RAD MIN
123
N/2
RECOMMENDED SOLDER PAD LAYOUT
.291 – .299
(7.391 – 7.595)
NOTE 4
.010
(0.254
–
–
.029
0.737)
×
45°
0° – 8° TYP
N/2
123 45678
.093 – .104
(2.362 – 2.642)
.037 – .045
(0.940 – 1.143)
.050
.009 – .013
(0.229 – 0.330)
NOTE 3
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
(1.270)
BSC _{.014 – .019}
(0.356 – 0.482)
TYP
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.004 – .012
(0.102 – 0.305)
S16 (WIDE) 0502
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LT1072
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