LT1021_05 Datasheet, PDF (15/16 Pages) Linear Technology – Precision Reference

PACKAGE DESCRIPTION
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
.040
(1.016)
MAX
SEATING
PLANE
.010 – .045*
(0.254 – 1.143)
.335 – .370
(8.509 – 9.398)
DIA
.305 – .335
(7.747 – 8.509)
.050
(1.270)
MAX
GAUGE
PLANE
.165 – .185
(4.191 – 4.699)
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.016 – .021**
(0.406 – 0.533)
45°
.028 – .034
(0.711 – 0.864)
.027 – .045
(0.686 – 1.143)
PIN 1
.200
(5.080)
TYP
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
.016 – .024
**FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS _{(0.406 – 0.610) H8(TO-5) 0.200 PCD 0204}
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.400*
(10.160)
MAX
8
7
6
5
.255 ± .015*
(6.477 ± 0.381)
.300 – .325
(7.620 – 8.255)
12
.045 – .065
(1.143 – 1.651)
34
.130 ± .005
(3.302 ± 0.127)
.008 – .015
(0.203 – 0.381)
.065
(1.651)
TYP
+.035
.325 _–.015
( ) ^8.255
+0.889
–0.381
.100
(2.54)
BSC
NOTE:
1. DIMENSIONS
ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.120
(3.048)
MIN
.018 ± .003
(0.457 ± 0.076)
.020
(0.508)
MIN
N8 1002
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LT1021
1021fc
15