LTC3407-2_15 Datasheet, PDF (14/16 Pages) Linear Technology – Dual Synchronous, 800mA, 2.25MHz Step-Down DC/DC Regulator

LTC3407-2
TYPICAL APPLICATIONS
1.2mm Height Core Supply
V_IN = 3.6V
TO 5.5V
C1*
4.7μF
V_OUT2 = 3.3V
AT 800mA
L2
2.2μH
C5, 22pF
RUN2 V_IN RUN1
MODE/SYNC
POR
LTC3407-2
SW2
SW1
R5
100k
POWER-ON
RESET
L1
2.2μH
C4, 22pF
V_OUT1 = 1.8V
AT 800mA
C3
4.7μF
s2
R4
887k R3
V_FB2
GND
196k
V_FB1
R1
301k
R2
604k
C1, C2, C3: TDK C1608X5ROJ475M
L1, L2: CMD4D11-2R2
*IF C1 IS GREATER THAN 3" FROM POWER SOURCE,
ADDITIONAL CAPACITANCE MAY BE REQUIRED.
C2
4.7μF
s2
3407 TA07
Efficiency vs Load Current
100
95
3.3V
90
85
1.8V
80
75
70
65
V_IN = 5V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
60
1
10
100
LOAD CURRENT (mA)
1000
3407 TA08
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
0.70 ±0.05
3.55 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
R = 0.125
TYP
6
0.40 ± 0.10
10
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
(DD) DFN REV B 0309
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
34072fc
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