LTC2859IDD Datasheet, PDF (14/16 Pages) Linear Technology – 20Mbps RS485 Transceivers with Integrated Switchable Termination

LTC2859/LTC2861
PACKAGE DESCRIPTION
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.70 ±0.05
3.60 ±0.05
2.20 ±0.05
3.30 ±0.05
1.70 ± 0.05
PIN 1
TOP MARK
PACKAGE ^{(NOTE 6)}
OUTLINE
0.25 ± 0.05
2.50 REF
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.200 REF
4.00 ±0.10
(2 SIDES)
R = 0.05
TYP
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
R = 0.115
7
TYP
0.40 ± 0.10
12
3.30 ±0.10
1.70 ± 0.10
6
0.25 ± 0.05
2.50 REF
1
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0806 REV D
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
14
.254 MIN
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.045 ±.005
.189 – .196*
(4.801 – 4.978)
16 15 14 13 12 11 10 9
.009
(0.229)
REF
.150 – .165
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 ± .0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.007 – .0098
(0.178 – 0.249)
.015 ± .004
(0.38 ± 0.10)
×
45°
0° – 8° TYP
1 234 5678
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
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