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LT1007_1 Datasheet, PDF (14/16 Pages) Linear Technology – Low Noise, High Speed Precision Operational Amplifiers | |||
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LT1007/LT1037
PACKAGE DESCRIPTION
0.040
(1.016)
MAX
SEATING
PLANE
0.010 â 0.045*
(0.254 â 1.143)
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
0.335 â 0.370
(8.509 â 9.398)
DIA
0.305 â 0.335
(7.747 â 8.509)
0.050
(1.270)
MAX
0.165 â 0.185
(4.191 â 4.699)
GAUGE
PLANE
0.500 â 0.750
(12.700 â 19.050)
REFERENCE
PLANE
0.016 â 0.021**
(0.406 â 0.533)
45°TYP
0.027 â 0.034
(0.686 â 0.864)
0.027 â 0.045
(0.686 â 1.143)
0.200
(5.080)
TYP
0.110 â 0.160
(2.794 â 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
â
â
0.024
0.610)
H8(TO-5) 0.200 PCD 0595
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
0.045 â 0.068
(1.143 â 1.727)
FULL LEAD
OPTION
0.300 BSC
(0.762 BSC)
0.023 â 0.045
(0.584 â 1.143)
HALF LEAD
OPTION
0.005
(0.127)
MIN
0.025
(0.635)
RAD TYP
0.405
(10.287)
MAX
8
7
6
1
2
3
5
0.220 â 0.310
(5.588 â 7.874)
4
0.200
(5.080)
MAX
0.015 â 0.060
(0.381 â 1.524)
0.008 â 0.018
(0.203 â 0.457)
0° â 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.045 â 0.065
(1.143 â 1.651)
0.014 â 0.026
(0.360 â 0.660)
OBSOLETE PACKAGES
0.100
(2.54)
BSC
0.125
3.175
MIN
J8 1298
14
sn100737 100737fbs
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