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LTC3542 Datasheet, PDF (12/16 Pages) Linear Technology – 500mA, 2.25MHz Synchronous Step-Down DC/DC Converter
LTC3542
APPLICATIONS INFORMATION
parallel with COUT, causing a rapid drop in VOUT. No regula-
tor can deliver enough current to prevent this problem, if
the switch connecting the load has low resistance and is
driven quickly. The solution is to limit the turn-on speed of
the load switch driver. A Hot SwapTM controller is designed
specifically for this purpose and usually incorporates cur-
rent limit, short circuit protection and soft-start.
Design Example
As a design example, assume the LTC3542 is used in a single
lithium-ion battery-powered cellular phone application. The
VIN will be operating from a maximum of 4.2V down to
about 2.7V. The load current requirement is a maximum
of 0.5A, but most of the time it will be in standby mode,
requiring only 2mA. Efficiency at both low and high load
currents is important. Output voltage is 1.8V.
With this information we can calculate L using:
L
=
f
•
1
ΔIL
•
VOUT
•
⎛
⎝⎜ 1–
VOUT
VIN
⎞
⎠⎟
Substituting VOUT = 1.8V, VIN = 4.2V, ΔIL = 200mA and
f = 2.25MHz gives:
L
=
1.8V
2.25MHz • 200mA
•
⎛
⎝⎜
1–
1.8V
4.2V
⎞
⎠⎟
=
2.28μH
Choosing a vendor’s closest inductor value of 2.2μH results
in a maximum ripple current of:
ΔIL
=
1.8V
2.25MHz • 2.2μH
•
⎛⎝⎜1–
1.8V⎞
4.2V⎠⎟
=
207.8mA
CIN will require an RMS current rating of at least
0.25A ≅ ILOAD(MAX)/2 at temperature and COUT will require
ESR of less than 0.2Ω. In most cases, ceramic capacitors
will satisfy these requirements. Select COUT = 10μF and
CIN = 10μF.
For the feedback resistors, choose R1 = 75k, R2 can be
calculated from:
R2
=
⎛
⎝⎜
VOUT
0.6V
–
1⎞⎠⎟
•
R1=
⎛
⎝⎜
1.8V
0.6V
–
1⎞⎠⎟
•
75k
=
150k
Figure 3 shows the complete circuit along with its efficiency
curve, load step response and recommended layout
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3542. These items are also illustrated graphically
in Figure 3b. Check the following in your layout:
1. The power traces, consisting of the GND trace, the SW
trace and the VIN trace should be kept short, direct and
wide.
2. Does the VFB pin connect directly to the feedback re-
sistors? The resistive divider R1/R2 must be connected
between the (+) plate of COUT and ground.
3. Does the (+) plate of CIN connect to VIN as closely as
possible? This capacitor provides the AC current to the
internal power MOSFETs.
4. Keep the (–) plates of CIN and COUT as close as pos-
sible.
5. Keep the switching node, SW, away from the sensitive
VFB node.
Hot Swap is a trademark of Linear Technology Corporation.
3542fa
12