LT6703-3_15 Datasheet, PDF (12/14 Pages) Linear Technology – Micropower, Low Voltage Comparator with 400mV Reference

LT6703-2/LT6703-3
LT6703HV-2/LT6703HV-3
PACKAGE DESCRIPTION
DC Package
3-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1717 Rev A)
1.35 p0.05
(2 SIDES)
1.00 p0.05
1.30 p0.05 (2 SIDES)
2.00 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 p0.10
(4 SIDES)
0.75 p0.05
1.35 p 0.05
(2 SIDES)
R = 0.05
TYP
1.00 p 0.05
(2 SIDES)
PIN 1 NOTCH
R = 0.20 OR
0.25 s 45o
CHAMFER
0.40 p0.10
0.70 p0.05
3
1
R = 0.125 TYP
0.25 p 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
(DC3) DFN 0309 REV A
NOTE:
0.00 – 0.05
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (W-TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
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