LT1086_04 Datasheet, PDF (11/16 Pages) Linear Technology – 1.5A Low Dropout Positive Regulators Adjustable and Fixed 2.85V, 3.3V, 3.6V, 5V, 12V

LT1086 Series
APPLICATIONS INFORMATION
In both cases the junction temperature is below the
maximum rating for the respective sections, ensuring
reliable operation.
Junction-to-case thermal resistance for the K and T pack-
ages is specified from the IC junction to the bottom of the
case directly below the die. This is the lowest resistance
path for heat flow. While this is also the lowest resistance
path for the H package, most available heat sinks for this
package are of the clip-on type that attach to the cap of the
package. The data sheet specification for thermal resis-
tance for the H package is therefore written to reflect this.
In all cases proper mounting is required to ensure the best
possible heat flow from the die to the heat sink. Thermal
compound at the case-to-heat sink interface is strongly
recommended. In the case of the H package, mounting the
device so that heat can flow out the bottom of the case will
significantly lower thermal resistance (≈ a factor of 2). If
the case of the device must be electrically isolated, a
thermally conductive spacer can be used as long as its
added contribution to thermal resistance is considered.
Note that the case of all devices in this series is electrically
connected to the output.
TYPICAL APPLICATIONS
5V, 1.5A Regulator
V_IN ≥ 6.5V
IN
+
10µF
LT1086 OUT
ADJ
*REQUIRED FOR STABILITY
5V AT 1.5A
121Ω
1%
+ _10µF*
TANTALUM
365Ω
1%
LT1086 • AI02
SCSI-2 Active Termination
TERMPWR
1N5817
+
4.25V
TO 5.25V
IN LT1086-2.85 OUT
GND
+
10µF
TANTALUM
10µF
TANTALUM
0.1µF
CERAMIC
110Ω
2%
110Ω
110Ω
2%
110Ω
18 TOTAL
110Ω
2%
110Ω
LT1086 • TA03
sn1086 1086ffs
11