LTC3200-5_15 Datasheet, PDF (10/12 Pages) Linear Technology – Low Noise, Regulated Charge Pump DC/DC Converters

LTC3200/LTC3200-5
U
OPERATIO
The power dissipated in the LTC3200/LTC3200-5 should
always fall under the line shown for a given ambient
temperature. The power dissipated in the LTC3200/
LTC3200-5 is given by the expression:
P_D ≡ (2V_IN – V_OUT)I_OUT
This derating curve assumes a maximum thermal
resistance, θ_JA, of 175°C/W for both the 6 pin ThinSOT
LTC3200-5 and the 8 pin MSOP adjustable LTC3200
which can be achieved from a printed circuit board layout
with a solid ground plane and a good connection to the
ground pins of the LTC3200/LTC3200-5. Operation out-
side of this curve will cause the junction temperature to
exceed 160°C which may trigger the thermal shutdown
circuitry.
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(LTC DWG # 05-08-1660)
0.007
(0.18)
0.043
(1.10)
MAX
0° – 6° TYP
0.021 ± 0.006
(0.53 ± 0.015)
SEATING
PLANE
0.009 – 0.015
(0.22 – 0.38)
0.0256
(0.65)
BSC
0.034
(0.86)
REF
0.118 ± 0.004*
(3.00 ± 0.102)
0.193 ± 0.006
0.005 ± 0.002 ^{(4.90 ± 0.15)}
(0.13 ± 0.05)
* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
8 76 5
1 234
0.118 ± 0.004**
(3.00 ± 0.102)
MSOP (MS8) 1100
10