RH07_15 Datasheet, PDF (1/2 Pages) Linear Technology – DICE SPECIFICATION

DICE SPECIFICATION
RH07
8
76
PAD FUNCTION
DIE CROSS REFERENCE (Notes 1, 2)
1. Offset Adjust
2. –IN
3.+IN
LTC Finished Order DICE CANDIDATE
Part Number
Part Number Below
4.V– (Substrate)
RH07
RH07 DICE
5. Do Not Connect
6. OUT
7. V+
8. Offset Adjust
1
2
3
4
Backside (substrate) is
78 × 98 mils
an alloyed gold layer.
Connect to V^–.
W
DICE ELECTRICAL TEST LI ITS _{VS = ±15V, VCM = 0V, TA = 25°C unless otherwise noted.}
SYMBOL
V_OS
I_OS
I_B
CMRR
PSRR
A_VOL
V_OUT
PARAMETER
Input Offset Voltage
Input Offset Current
Input Bias Current
Common Mode Rejection Ratio
Power Supply Rejection Ratio
Large-Signal Voltage Gain
Maximum Output Voltage Swing
SR
Slew Rate
P_D
Power Dissipation
CONDITIONS
V_CM = ±13
V_S = ±3V to ±18V
R_L ≥ 2k, V_O = ±12V
R_L ≥ 2k
R_L ≥ 1k
R_L ≥ 2k
No Load
No Load, V_S = ±3V
MIN
105
98
200
±11.5
±10.0
0.1
MAX UNITS
100
µV
3
nA
±4
nA
dB
dB
V/mV
V
V
V/µs
120
mW
6
mW
Note 1: Dice are probe tested at 25°C to the limits shown. Final specs after
assembly cannot be guaranteed at the die level due to yield loss and
assembly shifts. For absolute maximum ratings, typical specifications,
performance curves and finished product specifications, please refer to the
standard data sheet.
Note 2: For dice tested to tighter limits than those listed above and/or lot
qualification based on sample lot assembly and testing, please contact LTC
marketing.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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