NSR020A0X43Z Datasheet, PDF (16/19 Pages) Lineage Power Corporation – 4.5 - 14Vdc input; 0.59Vdc to 6Vdc Output; 20A output current

Data Sheet
July 28, 2009
Naos Raptor 20A: Non Isolated Power Module:
4.5 – 14Vdc input; 0.59Vdc to 6Vdc Output; 20A output current
Thermal Considerations
Power modules operate in a variety of thermal
environments; however sufficient cooling should always
be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel. The test set-up is shown in Figure
52. The preferred airflow direction for the module is in
Figure 53.
Wind Tunnel
PWBs
50.8
[2.00]
Power Module
76.2
[3.0]
7.24
[0.285]
Probe Location
for measuring
airflow and
ambient
temperature
Air
Flow
Figure 52. Thermal Test Set-up.
The thermal reference point, Tref used in the
specifications is shown in Figure 53. For reliable
operation this temperatures should not exceed 122^oC.
The output power of the module should not exceed the
rated power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device temperatures.
Figure 53. Temperature measurement location Tref.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves showing
the maximum output current that can be delivered at
different local ambient temperatures (TA) for airflow
conditions ranging from natural convection and up to
2m/s (400 ft./min) are shown in the Characteristics
Curves section.
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
These RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3°C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210°C. For Pb
solder, the recommended pot temperature is 260°C, while
the Pb-free solder pot is 270°C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with your
Lineage Power technical representative for more details.
LINEAGE POWER
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