QBE025A0B1 Datasheet, PDF (12/16 Pages) Lineage Power Corporation – 42 - 53Vdc input; 12Vdc Output; 25A output current

Data Sheet
March 27, 2008
QBE025A0B Series Power Modules, DC - DC Converters:
42 – 53Vdc input; 12Vdc Output; 25A output current
30.0
25.0
20.0
15.0
10.0
5.0
3m/s (600LFM)
2m/s (400LFM)
1m/s (200LFM)
0.0
0
20
40
60
80
100
LOCAL AMBIENT TEMPERATURE, T_A (°C)
Figure 16. Output Current Derating for the
QBE025A0B (Vo = 12V) in the Transverse Orientation
with baseplate and 0.25-inch high heatsink; Airflow
Direction from Vin(–) to Vout(--); Vin = 48V
30.0
25.0
20.0
15.0
10.0
5.0
3m/s (600LFM)
2m/s (400LFM)
1m/s (200LFM)
0.0
0
20
40
60
80
100
LOCAL AMBIENT TEMPERATURE, T_A (°C)
Figure 17. Output Current Derating for the
QBE025A0B (Vo = 12V) in the Transverse Orientation
with baseplate and 0.5-inch high heatsink; Airflow
Direction from Vin(–) to Vout(--); Vin = 48V
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
Layout Considerations
The QBE025 power module series are low profile in
order to be used in fine pitch system card
architectures. As such, component clearance
between the bottom of the power module and the
mounting board is limited. Avoid placing copper areas
on the outer layer directly underneath the power
module. Also avoid placing via interconnects
underneath the power module.
For additional layout guide-lines, refer to the
FLTR100V10 data sheet.
12
LINEAGE POWER