EQD020A0F Datasheet, PDF (11/15 Pages) Lineage Power Corporation – Eighth Brick Through-Hole Power Modules

Data Sheet
November 9, 2006
EQD020 Series Single Output: Eighth Brick Power Modules:
19-60Vdc Input; 3.3Vdc Output; 66W
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data is based on physical measurements
taken in a wind tunnel. The test set-up is shown in
Figure 22.
Wind Tunnel
PWBs
25.4_
(1.0)
Power Module
76.2_
(3.0)
x
6.55_
(0.258)
Air
flow
Probe Location
for measuring
airflow and
ambient
temperature
Figure 22. Thermal Test Set up.
The thermal reference point, T_ref, used in the
specifications is shown in Figure 23. For reliable
operation, this temperature should not exceed the
value specified in the Feature Specifications Table.
Tref
Figure 23. T_ref Temperature Measurement
Location.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Tyco Electronics
Power System representative for more details.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Tyco Electronics Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Tyco Electronics Power Systems
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