LA112B-XG-R1-AS-PF Datasheet, PDF (5/6 Pages) LIGITEK electronics co., ltd. – LED ARRAY

PART NO. LA112B/XG-R1-AS-PF
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 120seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:265°C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder joint to case)
Temp(° C)
265°
120°
265° C5sec Max
5° /sec
max
2° /sec
25°
max
0° ₀
Preheat
100
200
120 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
250
Time(sec)