LGFLN-311E Datasheet, PDF (13/14 Pages) LIGITEK electronics co., ltd. – 1W Power Light LED

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Recommended Soldering Conditions
1. PB-Free Reflow Solder
A
1~5° C/sec
1~5° C/sec
C
Preheat
180~200° C
E
Above 220 ° C
60 sec.Max.
D
250° C MaX.
10sec.Max
B
120 sec.Max.
Reflow Soldering should not be done more than two times.
Solder Reflow Process Parameters:
1.Reflow soldering of Helixeon emitters requires effective control of heating and cooling. Both the
rate of heating and cooling and the absolute temperatures reached are critical in assuring the
formation of a reliable solder joint while avoiding damage to the emitter during the reflow process.
The recommended temperature profile of solder reflow process is shown below in the figure.
1-1. Preheat
Set the temperature rising speed A at a rate of 1~5 ℃/s. Careful about rapid temperature
rise in preheat zone as it may cause excessive slumping of the solder paste.Appropriate
preheat time B will be from 60 to 120 seconds. If the preheat is insufficient, rather large
solder balls tend to be generated. Conversely, if performed excessively, fine balls and large
balls will generate in clusters at a time.Appropriate preheat ending temperature C will be
from 180 to 200 ℃. If the temperature is too low, non-melting tends to be caused in the area
with large heat capacity after reflow.
1-2. Heating
Careful about sudden rise in temperature as it may worsen the slump of solder paste.
Set the peak temperature D in the range from 220 to 250 ℃.Adjust the melting time that
the time over 220 ℃, E, will be from 30 to 60 seconds.
1-3. Cooling
Careful about slow cooling as it may cause the positional shift of parts and decline in joining
strength at times.
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