LEMWS59T80FZ10 Datasheet, PDF (3/31 Pages) LG Semicon Co.,Ltd. – MODEL NAME LEMWS59T80 Series

1. Features
- Lighting Color : White
- Lead Frame Type LED Package : 5.6×3.0×0.9 mm (L×W×H)
- Viewing Angle : 120˚
- Chip Material : InGaN
- Soldering Method : Reflow Soldering
- Taping : 12 mm conductive black carrier tape & antistatic clear cover tape.
3,000pcs/reel, Φ178mm wheel
- UL-recognized Component (E356829)
- RoHS Compliant
2. Applications
- Interior and Exterior Illumination
3. Outline Dimensions
( Unit : mm )
Pad Configuration
① Anode Pad
② Cathode Pad
③ Cathode Pad
Recommendable soldering pattern
(For reflow soldering)
 Tolerance unless otherwise mentioned are ±0.1 mm
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