3R070B-8 Datasheet, PDF (4/5 Pages) Shanghai Leiditech Electronic Technology Co., Ltd – Gas Discharge Tube

Product Characteristics
Materials
Product Marking
Glow to arc
transition current
Glow Voltage
Dull Tin Plate 17.5 ± 12.5 Microns
with Ceramic Insulator
Littelfuse ‘LF’ marking, Voltage and
date code.
~ 1Amp
~ 60-200 Volts
Storage and Operational
Temperature
Transverse Voltage (Delay Time)
Tested to ITU-T Rec. K.12
Arc Voltage
-40 to +90°C
< 0.2µSec
~ 10 to 35 Volts
Holdover Voltage
Tested to ITU-T Rec. K.12 & REA PE 80
< 150mS
Pb – Free assembly
- Temperature Min (T ) _s(min)
Pre Heat - Temperature Max (T ) _s(max)
- Time (Min to Max) (t _s)
Average ramp up rate (Liquidus Temp
(T_L) to peak
T_S(max) to T _L - Ramp-up Rate
-Temperature (T _L) (Liquidus)
- Temperature (t _L)
Peak Temperature (T _P)
Time within 5°C of actual peak
Temperature (t _p)
Ramp-down Rate
Time 25°C to peak Temperature (T _P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
5°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
10 – 30 seconds
6°C/second max
8 minutes Max.
260°C
T_P
T_L
T_S(max)
Ramp-up
T_S(min)
Preheat
t_S
25
time to peak temperature
(t 25ºC to peak)
t_P
Critical Zone
TL to T P
t_L
Ramp-down
Time
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100° C
150° C
60-180 seconds
Solder Pot Temperature:
Solder Dwell Time:
280° C Maximum
2-5 seconds
Note: Surge Arrestors with a Failsafe mechanism should be
individually examined after soldering
GDT 04 ^{All data is subject to change,Please check our data sheets at www.leiditech.com for updates.}